Перегляд за Автор "Izhnin, I."

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Conductivity type conversion in p- CdXHg1-XTe
(2003) Berchenko, N.; Bogoboyashchiy, V.; Izhnin, I.; Vlasov, Andriy; Kurbanov, K.; Yudenkov, V.; Берченко, Н.; Богобоящий, В.; Іжнін, І.; Власов, Андрій; Курбанов, К.; Юденков, В.
Investigations and comparative analysis of p-to-n type conductivity conversion processes on the identical samples of vacancy doped p-CdxHg–xTe (x 0.2) under ion-beam milling (IBM) and anodic oxide annealing and on the identical samples of As-doped p-CdxHg1–xTe (x 0.22) under IBM and anodic oxide annealing have been carried out. The conductivity type conversion has been observed at the considerable depth of the vacancy doped material both under IBM or under anodic oxide annealing while in the case with As-doped material only under IBM. It was considered that conversion in all these processes was determined by the mercury interstitial diffusion from corresponding mercury diffusion source and recombination with its native acceptors – cationic vacancies (in the first case) or with donor complex formations (in the second one). It has been shown that in the vacancy-doped p-CdxHg1–xTe the effective diffusion coefficients for the mercury interstitials that determines the depth of the converted layer are equal each other at equal temperatures either under thermal annealing in the saturated mercury vapour or anodic oxide annealing. It proves the identity of the mercury concentration in the diffusion source. Absence of the conversion under anodic oxide annealing in the As-doped p-CdxHg1–xTe is explained by insufficient Hg concentration in the source and it matches well with necessary condition for donor complex formation as it takes place under IBM.
Defect Structure Rebuilding by Ion Beam Milling of As and Sb Doped p-Hg1–xCdxTe
(2002) Berchenko, N.; Bogoboyashchiy, V.; Izhnin, I.; Vlasov, Andriy; Берченко, Н.; Богобоящий, В.; Іжнін, І.; Власов, Андрій
This study focuses on developing an understanding of the mechanisms of ion beam milling induced p-to-n conversion in extrinsically (As or Sb) doped p-Hg1––xCdxTe with x 0.2. The basis of modeling is the quasichemical approach and the model of superfast Hg interstitial atoms diffusion that has permitted to explain the similar conversion occurred in Hg vacancy-doped p-type Hg1––xCdxTe. In an acceptor doped material a donor is generated due to the formation of a complex (of interstitial Hg atom and an As or Sb atom located in the Te site). This model provides reasonably good fits with the experimental results obtained for As and Sb doped Hg1––xCdxTe epitaxial layers where the electron concentration in the converted n-layer corresponds to the concentration of the p-type dopants. Different efficiency of the conductivity conversion observed for As and Sb doped samples may be explained by different enthalpy of complex formation calculated for AsTe–HgI and SbTe– HgI pairs.
Mechanism for conversion of the conductivity type in arsenic doped p-CdxHg1–xTe subject to ionic etching
(2001) Bogoboyashchiy, V.; Vlasov, Andrii; Izhnin, I.
Based on an analysis of chemical diffusion of mercury in p-CdxHg1–xTe:As narrow-band solid solutions, a mechanism for conversion of the conductivity type upon ionic etching is suggested. It is shown that the n–p conversion of the conductivity in this case is due to the formation of a donor complex between arsenic in the Te sublattice and an interstitial Hg atom. Moreover, the electron concentration in the converted layer corresponds to the concentration of the implanted arsenic impurity. The theoretical results are confirmed by the experimental investigation of the electron concentration distribution over the n-layer of a p-CdxHg1–xTe:As epistructure converted upon ionic etching.
Relaxation of electrical properties of n-type layers formed by ion milling in epitaxial HgCdTe doped with V-group acceptors
(2006) Bogoboyashchyy, V.; Izhnin, I.; Mynbaev, K.; Pociask, M.; Vlasov, Andriy
The relaxation of electrical properties of As- and Sb-doped HgCdTe epitaxial layers, which were converted into n-type by ion milling, is studied. It is shown that donor complexes formed under ion milling and responsible for p-to-n conductivity type conversion are not stable, and their concentration decreases upon storage even at room temperature. Increasing the temperature of the storage speeds up the relaxation process. It is demonstrated that the relaxation is caused by the disintegration of the donor complexes that starts right after the end of the milling process because of the decrease in the concentration of interstitial mercury atoms, which were generated during the milling. The results presented in the paper are important for the development of the technology of photodetectors based on HgCdTe doped with V-group acceptors.
Time Relaxation of Point Defects in p- and n-(HgCd)Te after Ion Milling
(2003) Belas, E.; Bogoboyashchyy, V.; Grill, R.; Izhnin, I.; Vlasov, Andriy; Yudenkov, V.; Белас, Е.; Богобоящий, В.; Гріл, Р.; Іжнін, І.; Власов, Андрій; Юденков, В.
RH(77 K) of the n-type layer created by ion milling is investigated in Hg vacancy-doped, As-doped, and In-predoped p-type, and In-doped n-type Hg1−xCdxTe (0.2 < x < 0.22) samples. We show that the n-type layer is formed, and the temperature-activated relaxation occurs in all cases. The annealing at 75°C results in a gradual degradation of the converted n-type layer and a back n-to-p conversion within 8 days. The existence of a high-conducting, surfacedamaged region with a high-electron density (∼1018 cm−3) and a low mobility (∼103 cm2/Vs) is confirmed, and its influence on the relaxation is studied.